INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition

ABOUT THE SHOW

ユニテック・ジャパン株式会社

Exhibitor name
ユニテック・ジャパン株式会社
UNITEK JAPAN K.K.
Booth NO. 6B-222
Address

〒563-0025

大阪府

池田市城南2-7-6

2-7-6, Jyonan, Ikeda-city, Osaka, 563-0025

Website https://www.unitekjapan.co.jp/
Email
Phone number +81-727-54-5757
The Main Item

Movie
Details[1] A device that densifies metal surfaces while minimizing shape changes using a unique ultra-low-pressure blast.
This is a compact device, ideal for processing palm-sized workpieces.
Two devices are integrated to save space, and one power and air connection makes installation easy.

[Application]
■Mold surface polishing: It is possible to precisely polish the surface of molds that have been subjected to cutting, polishing, etc.
■Cleaning of metal surfaces: Accurately cleans discharge whitening layer and residue after nitriding treatment.
■Burr removal: Small burrs formed on the machined surface can be removed.
■Surface densification: Smoothes the unevenness of the metal surface where the resin flows, improving mold releasability.

Eliminates uneven polishing caused by different operators.
The name of Item[2] UNICLEAN
Details[2]

 
The name of Item[3] MINICLEAN
Details[3]

 
The name of Item[4] System for strain measurement with bluetooth transmission
Details[4]

 
The name of Item[5] Melt sensor
Details[5]

 
Details[6]

 
Details[7]

 
Category of
Exhibit Items

F. SURFACE FINISHING, MODIFYING, WELDING

Surface Finishing System

Washing Machine