INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition

AM EXPO

Promoting Additive manufacturing and business matching in the manufacturing field.

The additive manufacturing specialized exhibition will be held on May 2026 in Nagoya. The exhibition aims promoting the spread of using 3D-related technologies, the user case of AM (Additive manufacturing) and business matching within Japanese manufacturing field.
AM technology is becoming a revolutionary manufacturing method because it offers high design flexibility, well-suited for short lead times and low-volume production, and excels in material utilization efficiency. Many experts, engineers, and key-persons from the manufacturing field attend AM EXPO to learn the latest AM technology. We believe you can get a lot of business opportunities in AM EXPO.

Greeting from Japan Society of Additive Manufacturing, Organizer

The first AM EXPO was held in Nagoya, 2024, and the second edition was held in Tokyo, 2025. The next show will be held in Nagoya again. With support from exhibitors, AM users, and research organizations, the use of AM in actual manufacturing is growing stronger with each passing event.
AM EXPO is changing the role from only collecting information to the real business discussion platform. We hope AM EXPO will help your AM business grow, and look forward to your participation.

OUTLINE

Organizer Japanese Society of Additive Manufacturing
Co-organizer INTERMOLD Development Association / Port Messe Nagoya MICE Consortium
Sponsorship Ministry of Economy, Trade and Industry (Under application for approval)
Period April 16 - 18, 2025
Venue Tokyo Big Sight
Concurrent event INTERMOLD TOKYO
Die & Mold Asia TOKYO
Japan Metal Stamping Technology TOKYO
Management INTERMOLD Development Association
Phone +81-6-6944-9911
Email

EXHIBIT ITEMS

  • All kinds of related AM Technology
  • AM machines
  • 3D printing machines
  • 3D data analysis
  • Part makers
  • Materials (plastic, metal, rubber, ceramic, combined materials)

VISITORS CATEGORY

  • Automotive
  • Home electrical appliance
  • Communications devices
  • Dealers
  • Toys
  • Government Agencies
  • Aeroparts, Aerospace
  • Semiconductor, Metal devices
  • Food, Medical, Bio Industry
  • Architecture, Construction Materials
  • Stationary
  • Education/Research

Booth Charge

Presentaion Seminar

Exhibitor can have their own 30minutes presentation seminar. The openend seminar space will be located near exhibiting area.

Charge JPY55,000(tax incl.)/ 30 minutes
Capacity Approximately 30 to 40 people
*Seating available; standing also possible *Theater-style seating

POST SHOW REPORT

*TOTAL refers to the combined total of INTERMOLD, Die and Mold Asia, Japan Metal Stamping Technology Exhibition, and AM EXPO.

Application Deadline

December 31, 2026

DOWNLOAD

Application