News INTERMOLD/Die & Mold Asia/Japan Metal Stamping Technology Exhibition

NEWS

Jan.10.2026

[Osaka] Moulding GradPrix by Students will back to INTERMOLD Osaka again. See the detail here

Dec.25.2025

[Osaka/Nagoya] Year-End Greetings and Notice of New Year Holiday Closure

Aug.21.2025

We will hold a new fair, “Human Resource Development & Skills Transfer Fair.”

Jul.24.2025

[Osaka/Nagoya] INTERMOLD Osaka will be held in April and INTERMOLD Nagoya will be held in May 2026.
English page has been renewed. Please download the exhibition brochure at
"For exhibitor page"

Apr.12.2025

[Tokyo] 745 booths occupied with 525 companies and groups.
You can check the exhibitor list here.

Feb.03.2025

[Tokyo] Pre-registration for visitors is now open!

Jan.21.2025

[Tokyo] Visitor registration will be opened from February.

Dec.24.2024

[Tokyo] Year-End Greetings and Notice of New Year Holiday Closure

Aug.01.2024

[Tokyo] The application for INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Techology Exhibition/ AM EXPO 2025 has started.
Visit the link for the show detail.

Jul.01.2024

[Osaka/Tokyo/Nagoya] INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026.

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