INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition



[Osaka/Tokyo/Nagoya] ===
Office relocation announcement
INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed.


[Osaka/Tokyo/Nagoya] INTERMOLD 2025 and AM EXPO Tokyo will be held on April 16-18. 2025 at Tokyo Big Sight. It will NOT be held in Nagoya in 2025.
INTERMOLD Osaka and Nagoya will back in 2026.


[Osaka/Nagoya] Winter holiday: December 27 to January 3
Wish you have another wonderful year!


[Osaka/Nagoya] Application for Osaka and Nagoya in 2024 is started. Early application can get early bird discount.