OSAKA
April 20 - 23, 2022
NEWS
- Aug.01.2024
- The application for INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Techology Exhibition/ AM EXPO 2025 has started.
Visit the link for the show detail. - Jul.01.2024
- INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026. - Jun.03.2024
- Now you can download "FLOOR MAP for Nagoya"
- May.10.2024
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Office relocation announcement
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INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed. - May.01.2024
- Pre-registration for Nagoya is opened.
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