INTERMOLD/Die & Mold Asia/Japan Metal Stamping Technology Exhibition

INTERMOLD / Die & Mold Asia
Japan Metal Stamping Technology Exhibition 2020

The next INTERMOLD will be held on
-April 15-18, 2020 at INTEX Osaka
-July 15-18, 2020 at Port Messe Nagoya

The space application will be started accepting in July on WEB.
Before that, please download the excel format application and apply for your booth by email to
Your application will be registered as soon as the web system is ready.

Please note the booth rental charges are revised.
Also the consumption tax is raised to 10% from this year and all cost are included 10% tax.

  • APPLICATION (Osaka)
  • BOOKING INFORMATION (Osaka)
  • APPLICATION (Nagoya)
  • BOOKING INFORMATION (Nagoya)