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Exhibitor Detail
| Exhibitor name |
若園精機株式会社
WAKAZONO SEIKI Corporation
|
|---|---|
| Booth NO. | 3-401-40 |
| Address |
〒503-1301 岐阜県 養老郡養老町室原小栗栖450 450 Ogurisu, Murohara,Yourou-chou, Yourou-gun,Gifu,Japan |
| Website | http://www.wakazono.jp/ |
| info@wakazono.jp | |
| Phone number | +81-58-433-2230 |
| FAX | +81-58-433-2231 |
| PR message | I begin to sharpen 5 axles from aluminum ingot pure materials all-out, and a die-casting die” (2,250t) for motor parts introduces in a trial manufacture part”, “3D laser scanner”, a new die cutting technology including “the optical fiber laser pad welding” |
| The Main Item |
Big game die-casting die sample, big game aluminum trial product sample, 3D laser scanner
|
| Category of Exhibit Items |
A. MOLDS, MOLD MATERIALS Molds Mold Components M. PROTOTYPE, MODELING, 3D PRINTING Prototype Manufacturer N. PARTS PROCESSING TECHNOLOGY Cutting Processing |
