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Exhibitor name
ファインネクス株式会社
FINECS CO., LTD.
Booth NO. 631
Address

〒930-0281

富山県

中新川郡舟橋村舟橋415

415 Funahashi, Funahashi-mura, Nakaniikawa-gun, Toyama, 930-0281

Website http://www.finecs.co.jp/
Email info@finecs.co.jp
Phone number +81-76-462-1881
FAX +81-76-464-1500
PR message Finecs is able to support customers various requirements by the integrated manufacturing, heading process, pressing process, plating for hoop material, plastic molding, insert molding, and assembly process.
Finecs is able to design, develop and produce the production facilities.
The Main Item Connector terminal, Press-fit terminal, Insert molding parts,header parts

The name of Item[1] Sensor/connector parts(Stamping,Plating,Insert-molding,Auto assembly parts)
Details[1] Integrated manufacturing from pressing, through to surface treatment, through to insert-molding.
Our many years of experience in the processing of terminal connectors and their surface treatment have enabled an insert-molding that has a competitive advantage over QCD through the use of our original, unique manufacturing methods.

The name of Item[2] Pressfit terminals
Details[2] Press-fitting a pin of this type into a circuit-board hole firmly retains it without soldering. The terminal/pin has an area for press-fitting made by plastic working at one end of a square pin. We FINECS are making hedder terminal and stamping and plating for making press-fit terminal.

The name of Item[3] Connector terminals
Details[3] Made by cold-forging a wire. Used in a wide variety of connectors, among others. Two types of plating are used depending on the product: pre-process plating, where plated wires are used; and post-process plating, where barrel plating is used.
FINECS is ready to handle special shaped products, using various bending, heading, and crushing operations.

The name of Item[4] Ultra-small pins(Copper Pillars,Copper Column)
Details[4] The product lineup includes Copper Pillars(Cu Pillars),Copper Column(Cu Column) called micro-terminals for flip-chip mounting, and are used to connect the semiconductor chip and package interposer in a semiconductor package.
We use our experience in remaining the world PGA Pins (Terminals for CPUs) market leader to attain high quality and large manufacturing capacity.

Category of
Exhibit Items

A. MOLDS, MOLD MATERIALS

Molds

N. PARTS PROCESSING TECHNOLOGY

Plasticity Processing

Plastic Processing

Precision Processing

Others

P. ROBOT, AUTOMATION

Robot, Automation