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株式会社積層金型

Exhibitor name
株式会社積層金型
SEKISOU KANAGATA Co., LTD
Booth NO. 3-101-64
Address

〒737-0134

広島県

呉市広多賀谷2-3-12

2-3-12 Hirotagaya, Kure-shi,Hiroshima,737-0134,Japan

Website http://www.sekisou.com
Email
Phone number +81-823-73-4565
PR message Details of Business
□ High-cycle Resin Mold Die
Diffusion bonding laminated dies and diffusion bonding laminated blocks (Available for selection for processes from waterway design to finishing)
Features:The waterway in the die can be set to match the shape, enabling improved cooling performance and reduced molding cycle time
The Main Item Diffusion bonding laminated dies

Category of
Exhibit Items

A. MOLDS, MOLD MATERIALS

Molds

Mold Materials

Mold Components

Formed Products

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